The 48th of China Electronics Technology Group Co., Ltd. has successfully developed the first chemical mechanical polishing equipment with independent intellectual property rights for 0.25μm device feature size and 6-inch to 8-inch wafer flattening process requirements.
The successful development of this project has filled the blank of 0.25μm/6-inch to 8-inch wafer flattening equipment in China's IC equipment manufacturing industry. To realize the leap-forward development of China's microelectronics industry, China's independent intellectual property rights will be formed and China will be upgraded. The overall R&D level of integrated circuits and the core competitiveness of the industry and the breaking of the monopoly of foreign microelectronics technology have great practical significance.
The successful development of this project has filled the blank of 0.25μm/6-inch to 8-inch wafer flattening equipment in China's IC equipment manufacturing industry. To realize the leap-forward development of China's microelectronics industry, China's independent intellectual property rights will be formed and China will be upgraded. The overall R&D level of integrated circuits and the core competitiveness of the industry and the breaking of the monopoly of foreign microelectronics technology have great practical significance.
Vacuum Forming Machine,Vacuum Former,Vacuform Machine,Vacuum Mold Machine
haiyuanmachinery , https://www.lkfoamfoodboxmachine.com